In this paper we show a novel fabrication process capable of
yielding arbitrarily-shaped optical oxygen sensor patterns at sub-micron
resolution.
The wafer-level process uses a thin-film sacrificial metal
layer as intermediate mask, protecting the sensor material and enabling the use
of electron beam lithography for sensor patterning. Feature sizes down to 500
nm are demonstrated and currently only limited by the optical system used for
sensor readout.
Gaseous oxygen detection using the patterned sensors shows
Stern-Volmer behavior with a measured intensity ratio I100/I0
of 4.1. The process enables the integration of sensor patch arrays underneath
single cells for laterally registered oxygen sensing in cell-culture
applications.
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